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Electroless plating equipment - List of Manufacturers, Suppliers, Companies and Products

Electroless plating equipment Product List

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Electrolytic/non-electrolytic plating equipment

Electrolytic/non-electrolytic plating equipment

We offer a unique plating process tailored just for you, with keywords such as magnetic films, high-speed plating, uniform film thickness, and custom-made.

Regardless of the type of solution, we can propose plating equipment and processes tailored to your objectives. Most of the ordered equipment will have original specifications, allowing us to provide the equipment you desire. 1. Four types of plating methods: Supporting plating methods and processes according to your objectives. 2. Film thickness uniformity within ±2%: Face-up method. 3. Magnetic film plating compatible with all compositions: Production of plating solutions and film formation compatible with all compositions. 4. Supplied to all companies in the HDD industry: Magnetic film plating equipment.

  • Capacitor
  • Inductor Coil
  • Oscillator

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Electroless plating equipment for UBM formation for wafers

Electroless plating equipment for UBM formation for wafers

Plating chemicals, total proposals for surface treatment processes and equipment, electroless plating equipment for UBM formation for wafers.

Leveraging the know-how acquired as a surface treatment and plating chemicals manufacturer, we designed and developed the electroless plating system "TORYZA EL SYSTEM" for UBM formation in collaboration with equipment manufacturers. Along with the plating process "TORYZA EL PROCESS" for UBM formation on aluminum electrodes on wafers, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

  • Chemicals

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Formation of aluminum electrode UBM on wafer, electroless plating equipment for UBM formation.

Formation of aluminum electrode UBM on wafer, electroless plating equipment for UBM formation.

Plating chemicals, total proposals for surface treatment processes and equipment. UBM formation for power semiconductors, electroless plating process/plating equipment.

We have newly developed the "TORYZA EL PROCESS," an electroless plating process for forming UBM for power semiconductors that suppresses aluminum electrode delamination and localized corrosion, making it suitable for high-temperature applications. Additionally, leveraging the know-how gained as a surface treatment and plating chemical manufacturer, we have designed and developed the "TORYZA EL SYSTEM," an electroless plating equipment for UBM formation in collaboration with equipment manufacturers. We offer a comprehensive proposal that includes plating chemicals, surface treatment processes, and equipment.

  • Chemicals

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Electroless plating equipment for UBM formation for wafers

Electroless plating equipment for UBM formation for wafers

Plating chemicals, total proposals for surface treatment processes and equipment, electroless plating equipment for UBM formation for wafers.

Utilizing the know-how gained as a surface treatment and plating chemical manufacturer, we designed and developed the electroless plating equipment "TORYZA EL SYSTEM" for UBM formation in collaboration with equipment manufacturers. Along with the plating process "TORYZA EL PROCESS" for UBM formation on aluminum electrodes on wafers, we offer a comprehensive proposal for plating chemicals, surface treatment processes, and equipment for semiconductor back-end processes.

  • Chemicals

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